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Key Roadshow Projects for Shanghai International Investment Cooperation
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  • Semiconductor Integrated Circuit Equipment R&D and Industrialization Base Project

    Industry/Sector：
    Integrated Circuits 
    Main construction content and scale：
    Located in Lingang New Area, the project covers a total gross floor area of 61,640 square meters. The X-7 facility is a 3-story production workshop featuring cleanrooms(Class 1000), specialty gas rooms, pump rooms, power rooms, weak current rooms, and warehouses. The X-9 facility is a 4-story R&D office building with R&D office areas, IT center, control rooms, and conference rooms. The project seeks social capital for equity participation. 
    Cooperation/Investment Needs：
    Seeks social capital for equity participation. 
    Project contact：
    Ms. Wang 
    Contact number：
    18918882955 

  • Advanced Power Chips for New Energy Applications R&D and Industrialization Project

    Industry/Sector：
    Integrated Circuits 
    Main construction content and scale：
    Located in Jinqiao Lingang Park, the project establishes a high-reliability device simulation and design center, chip verification center, and automotive-grade advanced power chip R&D and testing center. It includes the development of 8-inch & 12-inch wafer testing and high-power high-temperature finished product testing R&D pilot production lines based on advanced power chips. The project seeks social capital for equity participation. 
    Cooperation/Investment Needs：
    Seeks social capital for equity participation. 
    Project contact：
    Ms. Wang 
    Contact number：
    18918882955 

  • Semiconductor equipment Project

    Industry/Sector：
    Integrated Circuits 
    Main construction content and scale：
    The company is a core supplier of integrated semiconductor high-end manufacturing equipment and processes. The company focuses on developing front-end advanced process dual damascene metal interconnect technology, aiming to break through long-standing foreign technical barriers through independent R&D, fill the gap in domestic advanced process electroplating equipment for semiconductors, improve the domestic semiconductor equipment supply chain, and further strengthen the integrated circuit industry chain. 
    Cooperation/Investment Needs：
    Specific financing needs not explicitly mentioned; implies needs for supply chain improvement and market substitution. 
    Project contact：
    Ms. Wang 
    Contact number：
    18918882955 

  • Semiconductor chip Project

    Industry/Sector：
    Integrated Circuits 
    Main construction content and scale：
    Following the Smart IDM model, the company specializes in chip design, device R&D, production, sales and application services of next-generation power semiconductors. It provides high-reliability, high-performance discrete devices, modules, and board-level solutions for electric vehicles, computing power, energy storage, wind power, and industrial drive applications. Its products include 600V-2000V silicon carbide(SiC) MOSFETs and modules, silicon-based superjunction(SJ) MOS, IGBT discrete devices and modules, and next-generation MCP power chips and board-level system solutions. 
    Cooperation/Investment Needs：
    Specific financing needs not explicitly mentioned; implies needs for multi-sector market expansion. 
    Project contact：
    Mr. Wei 
    Contact number：
    18918882959 

  • Integrated circuit design Project

    Industry/Sector：
    Integrated Circuits 
    Main construction content and scale：
    The company was established in Shanghai in 2021 and has a fully built team for the development and commercialization of general high-performance AI CPU chips. Following a'one chip, multiple uses' development strategy, products are applied across multiple market domains, including AI PCs, smart automotive cockpits, robots, and spatial computing devices on both the endpoint and edge. This has broken the bottleneck in the high-end edge AI computing chip sector, competing directly with companies like Qualcomm, MediaTek, and AMD. In July 2024, it released its first chip, which successfully completed the first batch, was powered up, and met mass production standards. This chip is designed based on Arm's most advanced architecture and integrates CPU/GPU/NPU heterogeneous design. It is the first domestic 6nm high-performance AI CPU, filling a gap in the Chinese market. 
    Cooperation/Investment Needs：
    Specific financing needs not explicitly mentioned; implies needs for multi-sector market penetration and ecosystem cooperation. 
    Project contact：
    Mr. Zhang 
    Contact number：
    18019023928 

  • Advanced Memory Project

    Industry/Sector：
    Integrated Circuits 
    Main construction content and scale：
    Top-tier global SSD controller tech; mass-produces & sells full-generation chips (SATA/PCIe3.0-5.0); targets leading comprehensive storage solutions provider in artificial intelligence and big data era Needs: RMB 300 million. Develop next-gen high-performance/large-capacity/reliable memory to break AI-era data bottlenecks. Seek social capital via JV or equity investment for product deployment in global data centers. 
    Cooperation/Investment Needs：
    Seeking social capital via JV or equity investment for product deployment in global data centers. 
    Project contact：
    Mr. Zhang 
    Contact number：
    18019023928 

  • SiC Production Line Project

    Industry/Sector：
    Integrated Circuits 
    Main construction content and scale：
    This project aims to establish a state-of-the-art manufacturing line for the large-scale production of Silicon Carbide(SiC) power semiconductor chips and modules. Focusing on the industrialization of third-generation semiconductor technology, it will primarily produce high-performance SiC MOSFETs and SBD chips for applications in new energy vehicles, photovoltaic power generation, and industrial control. 
    Cooperation/Investment Needs：
    Specific financing needs not explicitly mentioned; implies needs for production line construction and downstream application cooperation. 
    Project contact：
    Mr. Zhang 
    Contact number：
    18019023928 

  • Technical Innovation Project for Silicon Carbide Production Line

    Industry/Sector：
    Integrated Circuits 
    Main construction content and scale：
    The markets of electric vehicle(EVs), photovoltaic(PV) inverters, and EV battery chargers are rapidly growing. Silicon carbide(SiC) power devices, as core components, have been experiencing explosive growth. Over the past few years, domestic SiC industry chain has been established and domestic MOSFET chips are replacing imported chips. Meanwhile, the development of SiC technology enables domestic MOSFET chips enter into EV drivetrain market and domestic replacement in this area is projected to be gradually achieved in 2025-2026. As one of the pioneers among SiC chip manufacturers in China, GTA has been cooperating with several EV drivetrain customers. Their demands for capacity are urgent and has exceeded GTA’s current capacity. Therefore, it is necessary and urgent for GTA to expand SiC production through technical innovation, and be prepared for the uptrend in the EV drivetrain market. 
    Cooperation/Investment Needs：
    Urgently needs to upgrade existing automotive-grade production line equipment and processes through technical innovation to expand capacity (implies technical renovation funding or equipment cooperation needs). 
    Project contact：
    Mr. Zhang 
    Contact number：
    18019023928 

  • Semiconductor Project

    Industry/Sector：
    Integrated Circuits 
    Main construction content and scale：
    The company focuses on research and development and production of core flow control and electrical control components in the key processes of semiconductor manufacturing. The project plans to build a global headquarters and manufacturing base in Shanghai, plans to acquire 43 acres of land in the Lingang New Area. After the completion of the project, it will achieve an integrated research and development, sales, and, with an estimated maximum annual capacity of over 2 billion yuan and a maximum annual output value of about 2 billion yuan. 
    Cooperation/Investment Needs：
    Plans to build a global headquarters and manufacturing base in Shanghai, planning to acquire 43 acres of land in the Lingang New Area (implies land and construction funding needs). 
    Project contact：
    Mr. Zhang 
    Contact number：
    18019023928 

  • Multi-chip system Project

    Industry/Sector：
    Integrated Circuits 
    Main construction content and scale：
    The total investment of the project is 10 billion yuan, focusing on leading chiplet multi-chip system integration and packaging technology, and supporting the necessary advanced packaging and testing capabilities. The project continuously pursues standards comparable to the world's most advanced levels, helping to enhance the computing performance of chips and other functions. It is highly advanced and forward-looking, fully meeting China's demand for advanced packaging technology for AI and high-performance computing chip products. 
    Cooperation/Investment Needs：
    Total project investment is 10 billion yuan (implies huge investment needs). 
    Project contact：
    Mr. Zhang 
    Contact number：
    18019023928 
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